comb structure中文是什么意思

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中文翻译
造句

梳状构造；蜂窝状结构
梳状结构

comb n. ＝ combe.
structure n. 1.构造，结构；组织；石理，石纹。 2.建造物。 ...
comb-like structure 梳状结构
honey comb structure 蜂巢型结构; 蜂巢状结构
comb n. 1.梳，篦，梳机；【纺织；印染】精梳机；【航空】排管。 2.鸡冠；鸡冠形物[山顶、浪头等]。 3.蜂房；【动物；动物学】栉。 4.刻螺纹的某些器具。 cut the comb of 挫其锐气，杀傲慢气焰，使屈辱。 go through [over] with a fine comb 详细检查[研究]。 vt. 刷(毛)，梳(发)；(到处)搜寻，搜遍。 vi. (波浪)涌起浪花。 comb sb.'s hair the wrong way 使人发怒。 n. ＝ combe.
comb hair with a comb close 用梳子拢了拢头发
accessory comb 口旁粗纤
aenal comb 颊栉
aluminum comb 铝蜂窝
anal comb 臀栉; 尾梳
antenna comb 锊有栉
antennal comb 净角栉
antler comb 角状冠
arm comb 腕节; 腕栉
bamboo comb 竹篦
beard comb 须梳
black comb 黑梳子
blue comb 火鸡蓝鸡冠; 蓝冠病; 禽单核细胞增多症; 紫冠病
bone comb 骨梳
brace comb 支架窝; 赘脾
breda comb 无冠
brood comb 子脾
burr comb 赘脾
capped comb 封口蜂巢
celluloid comb 赛璐珞梳

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例句与用法

Functions : this type of soap not only features honey - comb structure , but also contains rich nourishing essence of honey
功效：这款香氛皂不仅有着蜂巢式的外观，更真正富含蜂蜜的滋养精华。
Experimental sample dct375 with collector - combed structure has better parameter such as icm , pq , pd and / r etc . than traditional - structure devices and overseas devices of the same kind . collector - combed structure technology opens up a new way for the further research of new high - frequency , microwave power devices
研制出的梳状集电结(基区)结构试验管dct375 ，其最大电流容量、最大输出功率、最大耗散功率以及频率特性等电参数明显比传统结构器件和国外同类产品有大的提高。
And the results of calculation and numerical simulation indicate , without increasing the intrinsic collector - junction area of power devices , collector - combed structure helps to raise the intrinsic heat - dissipating area and base ' s perimeter , improve heat - dissipating method of each cell of the chip , enhance the distribution uniformity of junction temperature and current of each cell of the chip , reduce the thermal resistance and raise the dissipation power pd and output power p0 , fairly well relax the contradiction among frequency , out - put power and dissipation power of the devices , and further improve the devices " property against second breakdown
而计算分析和二维数值模拟分析结果表明：梳状集电结(基区)结构在不增加器件本征集电结面积的条件下，增大了器件的本征散热面积和基区周长，改进了每个子器件单元内的散热方式，提高了单元内结温和电流分布的均匀性，降低了器件的热阻，增大了器件的耗散功率和输出功率，较好地缓解了目前传统结构中频率与功率、功耗的矛盾，并有利于改善器件抗二次击穿的性能。